Our team

Currently, the domestic semiconductor industry continues to upgrade its demand for high-end chip test sockets, and the space for domestic alternatives in high-end testing scenarios such as PCIe 5.0/6.0, DDR5, and HBM remains vast. This team maintains a clear consensus: the technological breakthroughs in chip test sockets are never achieved through the single-point innovation of a genius, but rather through a group of people deeply cultivating and supporting each other in various aspects such as materials, processes, design, and on-site implementation, gradually narrowing the gap with international top levels.

On the challenging path of high-end chip testing, a local team that understands technology, can collaborate, and dares to tackle tough challenges is the most solid foundation for the upward breakthrough of the domestic semiconductor industry chain.